Products Qixin QX5000 Sub-micron Multi-function Die Bonder RX3000 12" Multi-Functional Sorter RX2000SP3 8" Multi-Functional Die Sorter HX Series High-Speed IC Epoxy Die Bonder ZX2200 SiP Module Multi-Chip High-Precision Die Bonder Qixin QX5000 Sub-micron Multi-function Die Bonder RX3000 12" Multi-Functional Sorter RX2000SP3 8" Multi-Functional Die Sorter HX Series High-Speed IC Epoxy Die Bonder ZX2200 SiP Module Multi-Chip High-Precision Die Bonder Technologies Process Library Core Technology Tech Insights Precision Die Bonder & Die Sorter Equipment Driving Industry Innovation In the Name of Accuracy · New Standards for Smart Manufacturing ACCURACY, founded in 2010 in Suzhou, specializes in high-precision, intelligent micro-assembly and die-sorting equipment with 50%+ R&D staff. The product portfolio includes multi-chip die bonder, sub-micron high-precision die bonder, intelligent sorting systems, and more — widely applied in advanced packaging, IC packaging, power semiconductors, optoelectronics, sensors, and related fields. The company is committed to delivering comprehensive die attach solutions from process development to mass production deployment. Comprehensive quality management system Continuous investment in core equipment R&D Covering Global Industry Clusters Industry-Academia Collaboration Joint R&D with Top-Tier Universities Partnering with Innovators ACCURACY is committed to building an open industry ecosystem — together. Advanced Packaging Solutions From R&D to mass production — full coverage for diverse production needs Standard-die placement accuracy: ±0.5μm Force: 0.1 N–30 N Temperature: 450°C ± 1°C Placement Accuracy: ±3/7/10μm Supported Process: Epoxy / Multi-Chip / Flip Chip / DAF Placement Accuracy: ±10/25μm Sort Modes: Film/Tray to Film/Tray Placement Accuracy: ±38μm Sorting Modes: Film/Tray to Film/Tray Placement Accuracy: ±25μm Supported Wafer Size: Max 12" Full-cycle R&D and engineering deployment capabilities. Proven processes. Faster time-to-market. Underlying Technical Capabilities Self-developed core technologies. Knowledge sharing. Collaborative innovation. Application and Guidelines Covers full-scene mounting needs from traditional packaging to advanced packaging High-precision die bonding solutions for traditional packaging processes: QFP / BGA / LGA / QFN Advanced packaging and precision die bonding for high-performance computing chips: GPU / NPU / HBM Micro-assembly and hermetic packaging for MEMS devices: IMU, pressure sensors, micromirrors and more AuSn eutectic bonding and high-reliability die attach for RF/microwave devices: MMIC / PA / LNA High-precision alignment and micro-assembly for photonic devices: VCSEL / LiDAR / silicon photonics, meeting optical communication and sensing demands Advanced Packaging Platforms Complete die bonding solutions for advanced packaging processes: Interposer / 3D Stacking / Fan-out 16 Years of Relentless Progress From Micro‑assembly to Packaging — Sub‑micron Precision Began independent R&D of semiconductor packaging equipment. In 2015, the first-generation IC die bonder entered Huatian's supply chain, making it one of the early domestic equipment vendors to localize this process. Launched Fan-out high-precision die bonder; over 200 units deployed. Per the China 3D IC Alliance public directory, became a member back-end bonder maker in the alliance. Undertook Jiangsu Core Technology R&D Project. Accuracy surpassed 500nm; per Yole Group 2025 report, became the first Chinese C2W supplier featured in its reports. For product inquiries, technical support, or partnership opportunities — reach out anytime.